Backend Services

Fast Turnaround IC Packaging & PCB Related Services

We support IC packaging services from wafer / MPW die for thinning, dicing, sort, attach, wire bonding, encapsulation, laser marking and shipping packaged ICs.

Our PCB related services include design, fabrication, assembly, test & characterization.

Turnkey Solution for IC Packaging & PCB Related Services

Processes and solutions where we have deep experience in supporting our customers include:

Wafer Back
Grinding & Dicing

Sub-dicing
of MPW Dies

Die Sorting
for Pick & Place

Packaging
Solutions

Chip-On-Board
(COB) Assembly

High Frequency
Advanced Packaging
Solutions

PCB Design Solutions
(Design, Fabrication, Assembly)

Turnkey Solution for IC Packaging & PCB Related Services

Processes and solutions where we have deep experience in supporting our customers include:

Wafer Back Grinding & Dicing

Sub-dicing of MPW Dies

Die Sorting for Pick & Place

Packaging Solutions

Chip-On-Board (COB) Assembly

High Frequency Advanced Packaging Solutions

PCB Design Solutions (Design, Fabrication, Assembly)

IC Packaging Solutions

Packaging solutions we can offer, subject to a minimum order quantity, are:

Air Cavity Plastic Package

  • QFN footprint
  • Frequency to 10 GHz
  • MSL3
  • 3mm2 to 12mm2

Air Cavity LCP Package

  • QFN footprint
  • Frequency to 30 GHz
  • MSL3
  • 4mm2 to 8mm2

Air Cavity Ceramic Package

  • QFN footprint
  • Frequency to 40 GHz
  • MSL3
  • 3mm2 to 10mm2

Overmold Equivalent Package

  • QFN footprint
  • Frequency to 10 GHz
  • MSL3
  • 3mm2 to 12mm2

High Power Package

  • Single/multi DIE with SMTs
  • Customized footprint
  • mmWave frequency
  • MSL3
  • Design required

Flange MMIC Package

  • Single/multi DIE with SMTs
  • Customized footprint
  • Up to 20 GHz
  • MSL3
  • Design required

Chip On Board & Encapsulation

We focus on offering you a final product that is:

  • Compact
  • Lighter
  • Higher performance yet
  • Less expensive

High-Frequency Advanced Packaging Solutions

In-House MMIC Packages

  • Available from 4×4 mm2 to 8×8 mm2
  • Low NRE for tooling
  • Frequency performance up to 30 GHz
  • Excellent thermal management
  • Near hermetic – MSL3 compliant
  • Available singulated or array format

RJR – High Frequency Packaging Solution

Isothermal Sealing Solutions

The ITS system is simple, durable, and designed to produce quality package assemblies with high production yields. The Model 400, 500 and 600 units are the major workhorse units in operational use around the world.

Our design team will work closely with you and recommend the bet economic “ITS sealing system” to achieve your desired goals based on your package design, sealing reliability requirements and desired UPH.

Custom designed to your specifications

  • Built and warranted to deliver a seal you can rely on
  • Manual, semi-automatic, and fully automated sealing systems
  • Cost effective – 99+% assembly yields
  • True “Plug and Play”, containing pre-programmed sealing processes designed for your application

High Performance RQFN/ACP Package with optimized B-stage epoxies

We offer B-Stage pre-applied epoxies for almost any application where you need two components to bind with a near hermetic seal:

  • High Frequency Air Cavity RQFN Package
  • Optical sensors and MEMS Lids and Seals
  • ACP2 Package for Power Amplifiers

PCB Related Services (Design, Fabrication & Assembly)

We offer full-service solutions for PCB, from design to fabrication and assembly:

  • Full turnkey design, assembly and testing

  • Rigid, semi-rigid or flex options

  • RF microwave board designs

  • High speed PCB designs

  • Schematic creation, Component Library, Layout, DFM/DRC check and production release

  • Trace Matching, Differential Pair Routing, Impedance Control, Embedded

Assembly

With a typical prototype build time of 5-7 days, we can help with parts procurement (whether consigned BOM or as a full turn-key solution), from Chip-on-Board (COB) to SIP and Box Integration. Both options of leaded or ROHS-compliant lead-free solder are available. Able to assemble smallest SMT component 01005 (0402 Metric). Quality Grade up to IPC Class 3 workmanship. Our process supports Metal-Cladded PCB, Heavy Metal Sealing and Soldering.