Toshiba’s 3rd Generation Silicon Carbide (SiC) MOSFETs
Low on-resistance and significantly reduced switching lossSolving environmental and energy problems is an important global issue. While the demand for electric power continues to escalate, the call for energy conservation and the need for highly efficient and compact electric power conversion systems increases rapidly.
Power MOSFET using new SiC materials offer high voltage resistance, high-speed switching, and low on-resistance properties compared to conventional silicon (Si) MOSFET and IGBT products. This will greatly reduce power dissipation and supports a reduction in the size of equipment.
At Future Mobility Asia 2023 show, MEDs is proud to feature two reference designs with Toshiba’s SiC MOSFETs.
3-Phase AC 400 V Input PFC Converter
3-Phase AC 400 V Input PFC Converter
Toshiba 3rd generation SiC MOSFETs deliver low on-resistance and significantly reduced switching loss, ultimately, contributing to higher equipment efficiency.
The new products reduce on-resistance per unit area (RDS(ON)A) by about 43%[3], allowing the drain-source on-resistance * gate-drain charge (RDS(ON)*Qgd), an important index that represents the relationship between conduction loss and switching loss, to be lowered by about 80%[4]. This cuts the switching loss by about 20%[5], and lowers both on-resistance and switching loss.
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About MEDs Technologies
Established in 1996, MEDs Technologies serves Asia and the world from Singapore. We help customers to address their power supply related issues and wireless connectivity challenges across a diverse range of applications, such as the Electric-Vehicle (EV) and Satellite Communication.
As an engineering solutions partner, we tap on our in-house expertise and network of leading component brands, so that you get the best from our end-to-end, pre-and-post sales support.
In areas ranging from 5G and IoT to Smart Manufacturing, C-V2X, and Smart City solutions, we offer a wide range of wireless connectivity and EV-related products. These include power management and connectivity modules, antennas, routers, modems, sensors, and other specialized components.
We also provide PCB design and assembly as well as foundry link services targeted at systems and product designers in the field of power electronics and wireless technologies.
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